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PDF) Microring-based multi-chip WDM photonic module
PDF) Microring-based multi-chip WDM photonic module
a) Under-bump metallization and micro-bumps fabricated on the VLSI
Mehdi ASGHARI KHIAVI, University of Toronto, Toronto
Multiple System and Heterogeneous Integration with TSV-Interposers
PDF) 10 ??m fine pitch Cu/Sn micro-bumps for 3-D super-chip stack
Process and Key Technology of Typical Advanced Packaging
Metals, Free Full-Text
Stevan DJORDJEVIC, Principal Silicon Photonic Engineer
Roshanak SHAFIIHA, Staff Engineer, PhD, R&D
Philip AMBERG Research profile
Electromigration in solder joints: A cross-sectioned model system
Multiple System and Heterogeneous Integration with TSV-Interposers
Ivan SHUBIN Research profile