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a) Under-bump metallization and micro-bumps fabricated on the VLSI

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PDF) Microring-based multi-chip WDM photonic module

PDF) Microring-based multi-chip WDM photonic module

a) Under-bump metallization and micro-bumps fabricated on the VLSI

Mehdi ASGHARI KHIAVI, University of Toronto, Toronto

Multiple System and Heterogeneous Integration with TSV-Interposers

PDF) 10 ??m fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Process and Key Technology of Typical Advanced Packaging

Metals, Free Full-Text

Stevan DJORDJEVIC, Principal Silicon Photonic Engineer

Roshanak SHAFIIHA, Staff Engineer, PhD, R&D

Philip AMBERG Research profile

Electromigration in solder joints: A cross-sectioned model system

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Ivan SHUBIN Research profile